Process Flow

The printed circuit board (PCB) manufacturing process requires complex procedures to ensure the performance of the finished product. While circuit boards can be single-layer, double-layer or multi-layer, the manufacturing process used differs only after the first layer is produced. The number of steps required to produce a printed circuit board is related to its complexity, some may require 30 or more steps in the manufacturing process due to different PCB structures, skipping any steps or reducing procedures may negatively affect the performance of the circuit board influence.

Single Sided Board Fabrication Process:

  • 1. Pre Prod Engineering
  • 2. CAD/CAM and Drill Program
  • 3. Shearing
  • 4. Drilling
  • 5. Deburring
  • 6. Scrubbing
  • 7. Outerlayer Image
  • 8. Etching
  • 9. Resist Stripping
  • 10. Premask Inspection
  • 11. Scrubbing
  • 12. LPI Screening
  • 13. Tack Drying
  • 14. LPI Image
  • 15. LPI Final Baking
  • 16. HALS
  • 17. HALS Inspection
  • 18. Silkscreen(Legend)
  • 19. Fabrication
  • 20. Electrical Testing
  • 21. Final Inspection
  • 22. Final Audit
Single Sided Board Fabrication Process

Double Sided Board Fabrication Process:

  • 1. Pre Prod Engineering
  • 2. CAD/CAM and Drill Program
  • 3. Shearing
  • 4. Drilling
  • 5. Deburring
  • 6. Desmear
  • 7. Electroless Copper
  • 8. Scrubbing
  • 9. Outerlayer Image
  • 10. Copper Plating
  • 11. Tin Plating
  • 12. Resist Stripping
  • 13. Etching
  • 14. Tin Stripping
  • 15. Premask Inspection
  • 16. Scrubbing
  • 17. LPI Screening
  • 18. Tack Drying
  • 19. LPI Image
  • 20. LPI Final Baking
  • 21. HALS
  • 22. HALS Inspection
  • 23. Silkscreen(Legend)
  • 24. Fabrication
  • 25. Electrical Testing
  • 26. Final Inspection
  • 27. Final Audit
Double Sided Board Fabrication Process

Multilayer Circuit Board Fabrication Process:

  • 1. Pre Prod Engineering
  • 2. CAD/CAM and Drill Program
  • 3. Shearing
  • 4. Innerlayer Image
  • 5. Innerlayer Etching
  • 6. Resist Stripping
  • 7. Innerlayer Inspection
  • 8. Black Oxide
  • 9. Innerlayer Punch
  • 10. Multilayer Lay-Up
  • 11. Multilayer Pressing
  • 12. Shearing and Beveling
  • 13. Drilling
  • 14. Deburring
  • 15. Desmear
  • 16. Electroless Copper
  • 17. Scrubbing
  • 18. Outerlayer Image
  • 19. Copper Plating
  • 20. Tin Plating
  • 21. Resist Stripping
  • 22. Etching
  • 23. Tin Stripping
  • 24. Premask Inspection
  • 25. Scrubbing
  • 26. LPI Screening
  • 27. Tack Drying
  • 28. LPI Image
  • 29. LPI Final Baking
  • 30. HALS
  • 31. HALS Inspection
  • 32. Silkscreen(Legend)
  • 33. Fabrication
  • 34. Electrical Testing
  • 35. Final Inspection
  • 36. Final Audit
Multilayer Circuit Board Fabrication Process

As you can see, there is a lot of work going on in the PCB manufacturing process. To ensure that PCBs are manufactured with the quality, performance and durability you expect, choosing a POE with a high level of expertise and a focus on quality at every stage is the right decision.