Simple Testing

Simple Testing according to Customers’ testing files

Well-executed tests ensure a well-designed product can be successfully launched and achieve the fullest potential in the market.

Whether you require a PCB Assembly test only or a full suite of system tests, our team of engineers has extensive experience in developing and implementing integrated test strategies and cost effective tests for each assembly to significantly enhance your product reliability and to ensure only fully tested products are delivered to your and your clients.

AOI (Automated Optical Inspection)

AOI, is a key technique used in the manufacture and test of electronics printed circuit boards, PCBs. Automatic optical inspection, AOI enables fast and accurate inspection of electronics assemblies and in particular PCBs to ensure that the quality of product leaving the production line is high and the items are built correctly and without manufacturing faults.

They are able to detect a variety of surface feature defects such as nodules, scratches and stains as well as the more familiar dimensional defects such as open circuits, shorts and thinning of the solder. They can also detect incorrect components, missing components and incorrectly placed components.

AOI (Automated Optical Inspection)
AXI (Automated X-ray Inspection)

AXI (Automated X-ray Inspection)

Automatic optical inspection works very well in electronics manufacturing for printed circuit boards where joints are visible. However, many PCBs today are using technologies such as ball grid array, BGA integrated circuits and chip scale packages, CSP where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing complexity.

In these and many other instances it is necessary to carry out checks using automated X-Ray inspection, AXI, equipment that can not only check the solder joints under components, but also reveal many defects in solder joints that may not be visible with ordinary optical inspection equipment.X-ray inspection, not only are 2D or two-dimensional techniques available, but machines utilising 3D technology are available and give significant improvements in performance.

Flying Probe

Flying probe testing, as the name implies, uses test probes that “fly” i.e. the test probes move from test points to other test points as per instructions given by the specific software program that is written for the board under test. No custom fixture is required, so it could also be called a fixtureless in-circuit test if used on an assembled PCB. Hence, it is highly cost-effective for prototypes and low to mid-volume production.

Flying probe tester is capable of testing shorts, opens and component values. Additionally, a camera is equipped on the flying probe tester to help to find out missing components and to inspect component polarity. As positioning accuracy and repeatability of probes reach a scope between 5μm and 15μm, flying probe tester can accurately test the fabrication situation of the unit under test.

Flying Probe

HP TestJet Technology

TestJet Technology is the most widely used vectorless test technology in the world because it reliably identifies opens around (and inside) almost any IC package with a lead frame or metallic pins or leads to which the TestJet probe can capacitively couple–an enormous variety of device types.

ICT (In-Circuit Test)

In-Circuit Testing, ICT is a method of testing which helps detect defective components by using an electrical probe to check components at individual points. ICT checks for shorts, opens, resistance, capacitance, and other basic quantities which will flag any discrepancies. This fully automated test allows the techs to replace any faulty parts and thus move it along to QC for approval before its end use. In-circuit tests are usually conducted in two parts, such as Power-off Tests and Power-on Tests. As the name implies, in Power-off Tests, tests are conducted before power is applied and in the second part, tests are performed after power is applied.

Burn-in testing

Burn-in is a process done to components prior to regular use, in which the components are stressed to detect failure and ensure component reliability.
The PCB burn-in process is usually done at 125ºC, with electrical excitation applied to the samples. The process is facilitated by using burn-in boards where the samples are loaded. These boards are then inserted into the burn-in oven, which supplies the necessary voltages to the samples while maintaining the oven temperature at 125ºC. The electrical bias applied may either be static or dynamic.

Functional testing (FCT)

Functional testing usually is performed after the circuit boards are assembled and AOI & visual inspections are finished. Early testing allows us to find and correct component failures, assembly defects or potential design issues at an early stage and make troubleshooting as quick as possible. Finally, customers can deliver a perfect product to their clients in a short time frame. Functional testing is done mainly to avoid assembly issues including shorts, opens, missing components or the installation of incorrect parts.

ESS (Environmental Stress Screening)

Environmental stress screening (ESS) is a process where new or repaired electronic components are placed in a testing chamber and exposed to thermal cycling, vibration, and other environmental stresses. The purpose of ESS is to force the manifestation of latent mechanical defects that result in permanent or catastrophic failure of the component. This testing helps ensure the quality, functionality, and reliability of electronic hardware and components during shipping, storage, and use. PCB environmental stress testing is typically conducted during the design and development stages, and after the components are installed in electronic equipment.
We use a large, in-house, temperature- and humidity-controlled chamber to perform environmental test screenings. Tested components are run through several cycles of rapidly fluctuating temperature and condensing or non-condensing humidity, with dwells at both high and low extremes. This simulates the range of environmental conditions that the tested devices will be subject to, allows us to determine whether our products are doing what our customers expect.

HALT (Highly Accelerated Life Test)

Product reliability is essential to success in today's competitive global market. Highly accelerated life testing (HALT) is an intensive method used to expose design and process weaknesses, allowing you to improve them prior to product launch. Because of its accelerated nature, HALT testing is faster, less expensive, and more accurate than traditional testing techniques.
The test can accelerate a product's aging process from actual months into test minutes, much faster than traditional testing. HALT testing is designed to help you discover weaknesses in your product during the design stage, uncovering design or manufacturing process flaws before they reach your customer.

HASS (Highly Accelerated Stress Screening)

HALT testing is typically employed during the design or development stages of a product life cycle. HASS testing is slightly different, because its purpose is to speed the discovery of latent defects in manufacturing during the production stages of a product life cycle to reduce associated failures. The HASS process utilizes similar equipment to the HALT process, and the development of a usable HASS profile requires previous HALT results as well as other data and related validation information. In addition to identifying defects in existing products, HASS testing can also determine the impact that alternative components will have on your product design and durability.

Visual Inspection

Visual inspection is one of the most common inspection techniques employed during PCB assembly. As the name indicates, this involves inspecting the various components through naked eye or detectors. The choice of equipment will depend on the positions to be inspected. For instance, component placement and solder paste printing is visible to naked eyes. However, solder paste deposition and copper pad can be viewed only using a Z high-degree detector. The most common type of visual inspection is carried out at reflow joints using a prism, where the ray of light reflected is analyzed with different perspectives.

Visual Inspection